For silver plating of copper,$K[Ag(CN)_2]$ is used instead of $AgNO_3$. This is because ........
- A$A$ thin layer of $Ag$ is formed on $Cu$.
- BHigher voltage is required.
- C$Ag^+$ ions are completely removed from the solution.
- DDue to the low availability of $Ag^+$ ions,$Cu$ cannot displace $Ag$ from the $[Ag(CN)_2]^-$ ion.
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